JPH0360189B2 - - Google Patents

Info

Publication number
JPH0360189B2
JPH0360189B2 JP59121490A JP12149084A JPH0360189B2 JP H0360189 B2 JPH0360189 B2 JP H0360189B2 JP 59121490 A JP59121490 A JP 59121490A JP 12149084 A JP12149084 A JP 12149084A JP H0360189 B2 JPH0360189 B2 JP H0360189B2
Authority
JP
Japan
Prior art keywords
circuit board
printed circuit
led chip
mold
molding
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Lifetime
Application number
JP59121490A
Other languages
English (en)
Japanese (ja)
Other versions
JPS611067A (ja
Inventor
Toshihide Kawamura
Hoichiro Kashiwabara
Osamu Waki
Hiroo Sakai
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Stanley Electric Co Ltd
Original Assignee
Stanley Electric Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Stanley Electric Co Ltd filed Critical Stanley Electric Co Ltd
Priority to JP59121490A priority Critical patent/JPS611067A/ja
Publication of JPS611067A publication Critical patent/JPS611067A/ja
Publication of JPH0360189B2 publication Critical patent/JPH0360189B2/ja
Granted legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10H—INORGANIC LIGHT-EMITTING SEMICONDUCTOR DEVICES HAVING POTENTIAL BARRIERS
    • H10H20/00—Individual inorganic light-emitting semiconductor devices having potential barriers, e.g. light-emitting diodes [LED]
    • H10H20/80—Constructional details
    • H10H20/85—Packages
    • H10H20/852—Encapsulations
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/4805—Shape
    • H01L2224/4809—Loop shape
    • H01L2224/48091—Arched
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L25/00—Assemblies consisting of a plurality of semiconductor or other solid state devices
    • H01L25/03—Assemblies consisting of a plurality of semiconductor or other solid state devices all the devices being of a type provided for in a single subclass of subclasses H10B, H10D, H10F, H10H, H10K or H10N, e.g. assemblies of rectifier diodes
    • H01L25/04—Assemblies consisting of a plurality of semiconductor or other solid state devices all the devices being of a type provided for in a single subclass of subclasses H10B, H10D, H10F, H10H, H10K or H10N, e.g. assemblies of rectifier diodes the devices not having separate containers
    • H01L25/075—Assemblies consisting of a plurality of semiconductor or other solid state devices all the devices being of a type provided for in a single subclass of subclasses H10B, H10D, H10F, H10H, H10K or H10N, e.g. assemblies of rectifier diodes the devices not having separate containers the devices being of a type provided for in group H10H20/00
    • H01L25/0753—Assemblies consisting of a plurality of semiconductor or other solid state devices all the devices being of a type provided for in a single subclass of subclasses H10B, H10D, H10F, H10H, H10K or H10N, e.g. assemblies of rectifier diodes the devices not having separate containers the devices being of a type provided for in group H10H20/00 the devices being arranged next to each other

Landscapes

  • Led Device Packages (AREA)
  • Encapsulation Of And Coatings For Semiconductor Or Solid State Devices (AREA)
JP59121490A 1984-06-13 1984-06-13 プリント基板に装着されたｌｅｄチツプのモ−ルド方法 Granted JPS611067A (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP59121490A JPS611067A (ja) 1984-06-13 1984-06-13 プリント基板に装着されたｌｅｄチツプのモ−ルド方法

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP59121490A JPS611067A (ja) 1984-06-13 1984-06-13 プリント基板に装着されたｌｅｄチツプのモ−ルド方法

Publications (2)

Publication Number Publication Date
JPS611067A JPS611067A (ja) 1986-01-07
JPH0360189B2 true JPH0360189B2 (en]) 1991-09-12

Family

ID=14812451

Family Applications (1)

Application Number Title Priority Date Filing Date
JP59121490A Granted JPS611067A (ja) 1984-06-13 1984-06-13 プリント基板に装着されたｌｅｄチツプのモ−ルド方法

Country Status (1)

Country Link
JP (1) JPS611067A (en])

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR101487422B1 (ko) * 2012-12-20 2015-01-30 두산건설 주식회사 동결관 및 이를 이용한 지반 동결 공법

Families Citing this family (31)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH01146376A (ja) * 1987-12-02 1989-06-08 Stanley Electric Co Ltd チップｌｅｄ
JP2514414B2 (ja) * 1988-11-14 1996-07-10 ローム株式会社 プリント基板に対する発光素子の樹脂封止構造
US5169677A (en) * 1989-10-27 1992-12-08 Brother Kogyo Kabushiki Kaisha Method for forming lens at end portion of optical apparatus, optical signal transmission apparatus, and optical information processing apparatus
JPH0465463U (en]) * 1990-10-19 1992-06-08
JPH04111768U (ja) * 1991-03-14 1992-09-29 株式会社小糸製作所 モジユールタイプｌｅｄのモールド構造
JP2704321B2 (ja) * 1991-05-22 1998-01-26 シャープ株式会社 光半導体装置の製造方法
JP2787388B2 (ja) * 1992-03-06 1998-08-13 シャープ株式会社 発光装置のレンズ成形方法
US5607227A (en) * 1993-08-27 1997-03-04 Sanyo Electric Co., Ltd. Linear light source
NL9401104A (nl) * 1994-07-01 1996-02-01 Fico Bv Werkwijze, drager en matrijsdelen voor het omhullen van een chip.
CA2180807C (en) 1996-07-09 2002-11-05 Lynda Boutin Integrated circuit chip package and encapsulation process
DE19833039A1 (de) * 1998-07-22 2000-01-27 Elcos Gmbh Electronic Componen Elektronisches Bauteil und Verfahren zu seiner Herstellung
JP3930710B2 (ja) * 2000-09-13 2007-06-13 シチズン電子株式会社 チップ型発光ダイオード及びその製造方法
JP3801931B2 (ja) * 2002-03-05 2006-07-26 ローム株式会社 Ｌｅｄチップを使用した発光装置の構造及び製造方法
DE10357818B4 (de) * 2003-12-09 2009-10-08 Odelo Gmbh Verfahren zur Herstellung lichtemittierender Halbleiterdioden auf einer Platine
WO2005056269A2 (de) * 2003-12-09 2005-06-23 G.L.I. Global Light Industries Gmbh Verfahren zur herstellung lichtemittierender halbleiterdioden auf einer platine und leuchteinheiten mit integrierter platine
DE102004033533B4 (de) * 2004-07-09 2007-06-21 G.L.I. Global Light Industries Gmbh Leuchteinheit mit integrierter Platine
JP5004410B2 (ja) 2004-04-26 2012-08-22 Ｔｏｗａ株式会社 光素子の樹脂封止成形方法および樹脂封止成形装置
JP5128047B2 (ja) 2004-10-07 2013-01-23 Ｔｏｗａ株式会社 光デバイス及び光デバイスの生産方法
US7344902B2 (en) 2004-11-15 2008-03-18 Philips Lumileds Lighting Company, Llc Overmolded lens over LED die
KR100784057B1 (ko) * 2005-06-24 2007-12-10 엘지이노텍 주식회사 발광소자 패키지 및 발광소자 패키지 제조 방법
US7985357B2 (en) 2005-07-12 2011-07-26 Towa Corporation Method of resin-sealing and molding an optical device
KR100621154B1 (ko) * 2005-08-26 2006-09-07 서울반도체 주식회사 발광 다이오드 제조방법
DE102005048498B4 (de) * 2005-10-07 2007-06-21 Schefenacker Vision Systems Germany Gmbh Mehrfarbige Fahrzeugaußenleuchte
CN100481546C (zh) * 2007-11-26 2009-04-22 佛山市国星光电股份有限公司 一种底部注胶透镜成型的功率led及其制造方法
TW201128812A (en) 2009-12-01 2011-08-16 Lg Innotek Co Ltd Light emitting device
KR101034114B1 (ko) * 2009-12-01 2011-05-13 엘지이노텍 주식회사 발광 소자 및 그 제조방법
JP5343939B2 (ja) * 2010-07-08 2013-11-13 富士電機株式会社 半導体装置の製造方法
KR101218367B1 (ko) * 2010-08-04 2013-01-03 에이프로시스템즈 (주) 렌즈 제조방법 및 렌즈실장 기판
US10164159B2 (en) * 2016-12-20 2018-12-25 Samsung Electronics Co., Ltd. Light-emitting diode package and method of manufacturing the same
FR3065276B1 (fr) * 2017-04-12 2019-11-29 Valeo Vision Surmoulage d’un element optique sur un cadre thermoplastique
CN113193096B (zh) * 2021-04-29 2022-09-16 吴冬梅 一种低成本的led发光器件的制备方法及其led发光器件

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR101487422B1 (ko) * 2012-12-20 2015-01-30 두산건설 주식회사 동결관 및 이를 이용한 지반 동결 공법

Also Published As

Publication number Publication date
JPS611067A (ja) 1986-01-07

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